Powderblasting is one of the key technologies of iX-factory. With this unique technique iX-factory is able to create deep or through hole structures in silicon and glass substrates. Powderblasting is mostly used for making microfluidic ports.
Applications:
- Microfluidic channels and ports
- Electrical through wafer interconnects
Capabilities:
- Depth up to 1500 um
- Multiple depths
- Positive taper (angel 70)
- Roughness average 0,4 to 1,5 um
- Aligned front and back side etching
Examples:
Will follow!
