Physical vapor deposition (PVD) is a general term used to describe any of a variety of methods to deposit thin films by the condensation
of a vaporized form of the material onto various surfaces. The coating method involves purely physical processes such as high temperature
vacuum evaporation or plasma sputter bombardment.
iX-factory can deposit, metals as well as dielectrics.
Applications:
- Very wide, e.g.:
- Resistors for heating
- Thermistors
- Electrodes for EC- and amperometric sensors
- Capacitive actuation / sensing
- Coils
- Thermopiles
- Mirrors
- Magnetic sensors
- etc.
Capabilities:
- Cr, Au, Ni, Al, Pt, Pd, Ti, Ta, Cu, SiO2, ITO, CuNi, ...
- Thickness typically up to 2000 nm (depending on stress and adhesion)
- Sputtering and evaporation
- Multilayers
- Annealing (recrystallisation, stress reduction & diffusion of alloys)
- Passivations
