iX-factory offers a broad range of technologies on our own equipment. In the list below an overview is given over all the technologies and applications and capabilities of these technologies.

Our processes can be performed on 100, 150 as well as 200 mm silicon, SOI, borosilicate, fused silica and other substrates. We work with carefully selected wafer manufacturers who deliver on request single/double side polished, doping levels, roughness, bow/warp etc. Or you ship your own wafers, blank or processed.

See for yourself all technological services we offer. Download our poster or our folder for an overview:

• iX-factory Technology poster
• iX-factory Technology folder
• Flyer technological co-operation between iX-factory and SUSS MicroTec

Dry etching

• DRIE of silicon
• DRIE of glass
• Rie of Dielectrics

Wet etching

• Glass etching
• Anisotropic KOH etching
• Metal etching in various etchant

Multi-stack bonding

• Multi-stack bonding

Wafer bonding

• Anodic bonding
• Direct bonding
• Eutectic bonding

Powderblasting

• Powderblasting

CVD deposition

• LPCVD Silicon-rich-nitride
• LPCVD Silicon-nitride
• LPCVD Polysilicon
• PECVD Silicon-oxynitrides
• Thermal oxidation (wet & dry)
• TEOS silicon oxide

Thin film PVD depositions

• Metals
• Dielectrics
• Specials (ITO, ZnO, NiFe)

Miscellaneous cleanroom processes

• CMP
• Polymers (SU-8, polymide)
• Electroplating (Cu, Ni)

Inspection

• Optical Microscopy
• SEM (scanning Electron Microscope)
• Surface Profiling
• Ellipsometry

Backend processing

• Dicing
• Wire-bonding
• Assembly
• Fluidic interfacing