Anodic bonding
Anodic bonding is a bonding technique whereby two ore more wafers of different material are connected together. The bonding is done at lower temperature; which makes the integration of electrodes possible.
Applications:
- Cover lid for microfluidic channels (main application)
- Packaging (protection)
- Channel port connections
Capabilities:
- Silicon to glass
- SOI or DSOI to glass
- Triple stack bonding (glass-Si-glass)
- Glass to glass
- Aligned bonding
- Vacuum bonding
Examples:
Will follow!
Direct bonding
Direct bonding is a bonding technique whereby two or more wafers of the same material are connected together. The bonding is done at high temperature, which makes the bond very strong (bond-strength equal to material-strength). Direct bonding at lower temperature is also possible (lower bond strength).
Applications:
- Cover lid for microfluidic channels (main application)
- Packaging (protection)
- Channel port connections
Capabilities:
- Glass to glass
- Borosilicate glass to borosilicate glass
- Fused silica to Fused Silica
- Aligned bonding
Examples:
Will follow!
